Flexible High-Performance AOI Solution
Featuring a large 4 MP color camera and designed for high inspection speeds, the TR7700 SII
automated optical inspection system offers TRI’ trademark Dynamic Imaging technology for
powerful pre/post reflow inspection in a slimmer, faster and more economical package. Its robust
platform and advanced RGB+W lighting system bring better inspection of polarity and black
components down to 01005 chips in both lead-free and legacy PCB assemblies.
Designed for Precision
Unibody optical construction with high rigidity & dual-side
support combined with calibration procedures provide highly
stable & precise inspection.
System Precision
Cmk>1.67 with TRI calibration target
GR&R<10 % with TRI calibration target,
(± 50 µm) x, y misalignment/shift )
Efficient Programming
Cross-system inspection programming reduces staff time spent
on program modifications
Speed: Fast Inspection in Both Resolutions
• 18 μm: 170 cm2/sec (26.3 in2/sec)
15 μm: 120 cm2/sec (18.6 in2/sec)
10 μm: 60 cm2/sec (9.3 in2/sec)
• 330 x 250 mm: 8 sec (18 μm); 9.6 sec (15 μm); 18.8 sec (10 μm) (excludes board loading &
unloading time)
High Resolution Imaging
High speed image acquisition in high resolution
RGB+White lighting results in optimal image quality for markings, solder or black components
New Color Space Algorithms
TRI’s new adaptive algorithms use color space processing to increase inspection accuracy, reduce
false calls and improve inspection results while reducing time necessary for inspection fine tuning
and the number of alternative images required.
SMT Line Integration
Centralized production line management increases operator productivity and response time. TRI's
integrated solution includes the following four components.
• Offline Editor
This application allows for centralized independent adjustment and fine tuning of inspection
algorithms on previously scanned images while providing immediate feedback. The completed
program can then be uploaded to the in-line inspection machines to improve inspection stability
and accuracy.
• Control Center
The core component at the heart of a production facility, the control center allows real-time
monitoring and operation of multiple inspection machines across production lines.
YMS Lite
TRI's Yield Management System links inspection data from SPI, AOI and AXI systems to trace
defect roots throughout the PCB assembly line. Modular architecture provides centralized
inspection management, real time defect monitoring with analysis and defect knowledge
management necessary to identify problems and implement solutions to maximize production
yields.
• Quality Validation
Fully automated collection of good/failed images from a complete production run allows testing,
tuning and verification of adjusted program parameters without reloading tested boards. This
allows engineers to save inspection time when fine tuning and significantly speeds up New Product
Introduction (NPI)
| PCB & Conveyor System | TR7700 SII* | TR7700 SII* TR7700 SII DUAL LANE |
| Top View Camera | 4 Mpx high speed color camera |
| Optical Resolution | 10, 15 or 18 μm |
| | | |
| Min. PCB Size | 50 x 50 mm |
| Max. PCB Size | 510 x 460 mm (20.1 x 18.1 in) | 510 x 310 mm 2 lanes (20.1 x 12.2 in)
510 x 590 mm 1 lane (20.1 x 23.2 in) |
| PCB Thickness | 0.6 - 5 mm |
| PCB Transport Height | 900 - 965 mm (35.4 - 38.0 in) | 880 - 920 mm (34.6 - 36.2 in) |
| Max. PCB Weight | 5 kg (11.0 lbs) | 3 kg (6.61 lbs) |
| PCB Carrier/Fixing | Step motor driven & pneumatic clamping |
| Dimensions (W x D x H) | 1000 x 1410 x 1500 mm | 1100 x 1670 x 1550 mm |
| Weight | 850 kg (1873 lbs) | 1100 kg (2425 lbs |
| Air Requirement | 0.6 MPa (87 psi) |
